Senior IC Packaging Designer

IC Packaging Designer

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless systems? At Falcomm, we are transforming innovative semiconductor research into real-world solutions through high-performance, energy-efficient RF power amplifier technologies. Our mission is to deliver cutting-edge wireless solutions that push the boundaries of performance, efficiency, and integration.

Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing and optimizing package architectures that support high-frequency performance, thermal efficiency, and manufacturability. The position requires close collaboration with RFIC designers, layout engineers, testing teams, and manufacturing partners to ensure successful integration of silicon, GaN, or III-V MMICs devices into production-ready packages.

Responsibilities:

• Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages.
• Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA tools.
• Work with signal integrity, EM, and thermal simulation teams to validate package performance.
• Generate package documentation, fabrication drawings, and assembly specifications.
• Participate in design reviews, prototype builds, and failure analysis to improve RF performance and yield.
• Collaborate with RFIC designers to co-optimize chip and package performance, minimizing parasitics and signal loss.
• Support package integration with PCB design teams to ensure optimal RF performance at the system level.
• Coordinate with fabrication and assembly partners.