✨ About The Role
- The role involves thermal mechanical simulation and design for a quantum computer, focusing on electronic optical assembly.
- Responsibilities include developing methodologies for chip power modeling and measurement, and correlating chip behavior with simulations.
- The engineer will analyze field issues related to electronic optical assembly design and provide necessary solutions.
- General design activities will include requirements management, materials selection, and conducting Design Failure Modes and Effects Analysis (FMEA).
- The position requires active participation in cross-functional project teams throughout all phases of product development.
âš¡ Requirements
- A successful candidate will have a B.Sc., M.Sc., or Ph.D. in Mechanical Engineering, Aerospace Engineering, Nuclear Engineering, or Physics.
- The ideal individual will possess strong knowledge of heat transfer, fluid mechanics, and structural mechanics, particularly in cryogenic conditions.
- Experience with advanced analysis tools such as Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) is essential.
- Excellent written and verbal communication skills are necessary for effective collaboration with cross-functional teams.
- The candidate should be adaptable and capable of managing multiple assignments simultaneously.